By Stefan Dimov, Wolfgang Menz, Bertrand Fillon
This paintings covers the most recent cutting-edge learn effects from best ecu researchers in complicated micro applied sciences for batch processing of metals, polymers, and ceramics, and the improvement of recent construction systems for micro systems-based products.These contributions are from top authors at a platform counseled and funded via the ecu Union R&D neighborhood, in addition to top universities, and self sustaining study and company businesses. This complete number of listed and peer reviewed articles incorporates a CD with seek performance. * comprises authoritative papers that mirror the most recent advancements in micro applied sciences and micro systems-based items* contains a easy CD Rom with seek performance
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Extra info for 4M 2006 - Second International Conference on Multi-Material Micro Manufacture
Previously it was shown already that Xe+ or Ar+ ions are more effective for the magnetic modification by two orders of magnitude compared to He+ ions . The magnetic patterns obtained after an ion projection dose of 4 x 1013 Ar+ cm-2 were investigated by Kerr Microscopy and by magnetic force microscopy (MFM) (fig. 5). It was confirmed that magnetic patterns with smallest dimensions of 70 nm could be created arranged in circular recording tracks. Moreover, atomic force microscopy (AFM) measurements indicated that the surface roughness of the magnetic media which was below 2 nm remained unchanged by the patterning process.
Bory, A. Fuchs, D. Freida, N. Manaresi, M. Ruty, J. Bablet, K. Gilbert, N. Sarrut, F. Baleras, C. L. Villiers and L. Fulbert, Fabrication of hybrid plastic-silicon micro-fluidic devices for individual cell manipulation by dielectrophoresis, Proc. SPIE-Int. Soc. Opt. , 2003, 5345, 7–16.  K. Najafi, “Micropackaging technologies for integrated microsystems: Applications to MEMS and MOEMS,” presented at the SPIE. , San Jose, CA, 2003. H. Starck, K. Najafi, "A Low-Temperature ThinFilm Electroplated Metal Vacuum Package", Journal of Microelectromechanical Systems, Vol.
7] developed a stencil mask process allowing a membrane thickness of 3 μm and mask sizes of up to 126 mm in diameter. The mask is fabricated on a silicon-on-insulator (SOI) wafer where the insulator layer is used as an etch stop. A deep RIE technique is used to etch the mask features that are written by e-beam lithography. The deep RIE process provides the steepness of the vertical sidewalls. The silicon membrane is coated with a thin carbon layer to protect the mask from ion damage Fig. 2. Sketch of the CHARPAN (Charged Particle Nanopatterning) tool concept.