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By Dunwen Zuo, Chuanzhen Huang, Ming Chen, Guo Hun

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46(2006), p. 4(2000), p. 15–47 [4] Movahhedy M R, Altintas Y: J. Manufacturing Science and Engineering, Vol. D. Thesis ( McMaster Univeristy, Canada, 2001) Key Engineering Materials Vol. C. Wang1,a, B. H. M. S. S. com Keyword: HFCVD, CVD diamond coated SiC compacting dies, working lifetime, processing quality Abstract: Silicon carbide (SiC) is a promising material for fabricating wire compacting dies due to its advantages of light weight and even high wear resistance over the tungsten carbide, which currently is the most popular material used to produce compacting dies.

Key Engineering Materials Vol. e. 3mm, with the increase of groove’s top-width, the optimal capillary limit remains almost the same; when groove’s 26 Anti-Fatigue Design and Manufacturing Technologies I depth is fixed and the ratio of groove’s top-width to its depth attains its optimal value, micro heat pipes with the grooved wick of small-angle dove-tailed structure (that is, a sector structure) obtain the highest capillary limits. e. 5, be employed so as to obtain better heat transfer performances.

1. Milling model mesh of jointing blank is the same with jointing model. The milling workpiece is fixed on the table in milling process. 3 is applied to the milling model before milling simulation. After milling, the workpiece is cooled to room temperature at room temperature, and the clamping constraints are removed. 5. 5. B and C enlarged parts can also be seen the bending degree of the key eye side part (B-side) is higher than the jointing initiating side (C-side). A enlarged part can be seen milling plate is shown outward extension along the length direction.

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