Download Lead-Free Solders: Materials Reliability for Electronics by Arthur Willoughby, Peter Capper, Safa Kasap(eds.) PDF

By Arthur Willoughby, Peter Capper, Safa Kasap(eds.)

Content material:
Chapter 1 Reliability of Lead?Free digital Solder Interconnects: Roles of fabric and repair Parameters (pages 1–9): okay. N. Subramanian
Chapter 2 part Diagrams and Their purposes in Pb?Free Soldering (pages 11–44): Sinn?Wen Chen, Wojciech Gierlotka, Hsin?Jay Wu and Shih?Kang Lin
Chapter three section Diagrams and Alloy improvement (pages 45–70): Alan Dinsdale, Andy Watson, Ales Kroupa, Jan Vrestal, Adela Zemanova and Pavel Broz
Chapter four interplay of Sn?Based Solders with Ni(P) Substrates: section Equilibria and Thermochemistry (pages 71–118): Clemens Schmetterer, Rajesh Ganesan and Herbert Ipser
Chapter five ‘Effects of adlescent Alloying Additions at the homes and Reliability of Pb?Free Solders and Joints’ (pages 119–159): Sung ok. Kang
Chapter 6 improvement and Characterization of Nano?Composite Solder (pages 161–177): Johan Liu, Si Chen and Lilei Ye
Chapter 7 Chemical alterations for Lead?Free Soldering and Their impact on Reliability (pages 179–194): Laura J. Turbini
Chapter eight effect of Microstructure on Creep and excessive pressure expense Fracture of Sn?Ag?Based Solder Joints (pages 195–231): P. Kumar, Z. Huang, I. Dutta, G. Subbarayan and R. Mahajan
Chapter nine Microstructure and Thermomechanical habit Pb?Free Solders (pages 233–250): D. R. Frear
Chapter 10 Electromechanical Coupling in Sn?Rich Solder Interconnects (pages 251–271): Q. S. Zhu, H. Y. Liu, L. Zhang, Q. L. Zeng, Z. G. Wang and J. okay. Shang
Chapter eleven impression of Temperature?Dependent Deformation features on Thermomechanical Fatigue Reliability of Eutectic Sn?Ag Solder Joints (pages 273–295): Andre Lee, Deep Choudhuri and okay. N. Subramanian
Chapter 12 Sn Whiskers: motives, Mechanisms and Mitigation concepts (pages 297–321): Nitin Jadhav and Eric Chason
Chapter thirteen Tin Whiskers (pages 323–335): Katsuaki Suganuma
Chapter 14 Electromigration Reliability of Pb?Free Solder Joints (pages 337–373): Seung?Hyun Chae, Yiwei Wang and Paul S. Ho
Chapter 15 Electromigration in Pb?Free Solder Joints in digital Packaging (pages 375–399): Chih Chen, Shih?Wei Liang, Yuan?Wei Chang, Hsiang?Yao Hsiao, Jung Kyu Han and ok. N. Tu
Chapter sixteen results of Electromigration on digital Solder Joints (pages 401–422): Sinn?Wen Chen, Chih?Ming Chen, Chao?Hong Wang and Chia?Ming Hsu
Chapter 17 Thermomigration in SnPb and Pb?Free Flip?Chip Solder Joints (pages 423–442): Tian Tian, okay. N. Tu, Hsiao?Yun Chen, Hsiang?Yao Hsiao and Chih Chen
Chapter 18 impression of Miniaturization on Mechanical Reliability of Lead?Free Solder Interconnects (pages 443–485): Golta Khatibi, Herbert Ipser, Martin Lederer and Brigitte Weiss

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Download Superconducting Quantum Electronics by H. Lübbig (auth.), Director and Professor Dr. Volkmar Kose PDF

By H. Lübbig (auth.), Director and Professor Dr. Volkmar Kose (eds.)

With the magnificent discovery of superconductivity at temperatures above a hundred ok, this box was once not just introduced into the general public eye, but in addition prompted learn in universities, medical associations and undefined, therefore carrying on with the interesting improvement which started with the invention of the Josephson impression within the sixties. Cryoelectronics has develop into a unique department of cryophysics and cryotechnics and at the present time performs a popular position at any time when excessive solution and precision measurements are required. prompted through this improvement, seven years in the past scientists operating in cryoelectronics within the Federal Republic of Germany felt the need for normal conferences permitting a unfastened alternate of principles and effects completed. Seminars below the identify of "Kryoelektronische Bauelemente" have been held for the 1st time on the Physikalisch-Technische Bundesanstalt in Braunschweig in 1982 at the celebration of the a hundredth anniversary of the beginning of Walther MeiBner, a pioneer in superconductivity. in view that then, conferences were held each year at various venues in Germany. it truly is now felt that the prestige of this box necessitates a evaluation of the result of the previous, an outline of the present state-of-the-art, and a dialogue of destiny views. This ebook, entitled SUPERCONDUCTING QUANTUM ELECTRONICS is a suite of invited lectures and contributions in an effort to tell the reader at the best difficulties related to basics, delicate detectors and precision metrology being studied by means of assorted groups.

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Download Electronics Reliability and Measurement Technology. by Joseph S. Heyman PDF

By Joseph S. Heyman

Content material:

, Page v

, Pages vii-viii, Joseph A. Heyman
- government precis of findings and recommendations

, Pages 1-6
Measurement technological know-how and production technology research

, Pages 7-16, D. Howard Phillips
Nondestructive SEM for floor and subsurface wafer imaging

, Pages 17-33, Roy H. Propst, C. Robert Bagnell, Edward I. Cole Jr., Brian G. Davies, Frank A. DiBianca, Darryl G. Johnson, William V. Oxford, Craig A. Smith
Surface inspection-research and development

, Pages 34-36, J.S. Batchelder
- Sensors built for in-process thermal sensing and imaging

, Pages 37-41, I.H. Choi, K.D. Wise
Wafer point reliability for high-performance VLSI design

, Pages 42-54, Bryan J. Root, James D. Seefeldt
Wafer point reliability checking out: an concept whose time has come

, Pages 55-59, O.D. Trapp
Micro-focus X-ray imaging

, Pages 60-67, Michael Juha
Measurement of opaque movie thickness

, Pages 68-78, R.L. Thomas, J. Jaarin, C. Reyes, I.C. Oppenheim, L.D. Favro, P.K. Kuo
Intelligent laser soldering inspection and strategy control

, Pages 79-88, Riccardo Vanzetti
Rupture trying out for the standard keep watch over of electrodeposited copper interconnections in high-speed, high-density circuits

, Pages 89-106, Louis Zakraysek
- Heterodyne holographic interferometry: High-resolution ranging and displacement measurement

, Pages 107-122, James W. Wagner
- “Whole wafer” scanning electron microscopy

, Pages 123-128, J. Devaney
This web page is deliberately left blank

, Page 129

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Download Parts Selection and Management by Michael Pecht PDF

By Michael Pecht

Elevate profitability and decrease possibility via powerful elements choice and management

enterprises realize that know-how should be the most important to fueling product layout and improvement. yet simply as crucial-if no longer more-to a company's good fortune are the choices approximately while, what, and the way a expertise may be used. Few businesses have failed as the correct expertise used to be no longer on hand; many have failed while a know-how was once no longer successfully chosen and managed.

elements choice and administration is a consultant to expanding corporation profitability and lowering the time-to-profit throughout the effective administration of the method of elements choice and administration. Taking an "eyes-on, hands-off" method of components choice, this guidebook addresses risk-assessment, decision-making steps, and next administration actions. The booklet covers every little thing from methodologies for components choice and administration, product standards and standards, and producer review approaches to how you can song half alterations during the offer chain, reliability overview, and environmental, legislative, and criminal issues.

Written by way of a pro expert, instructor, and writer within the box, the e-book allows businesses to:
* hire powerful danger overview and mitigation techniques
* Make an educated company-wide selection approximately components choice and management
* decide upon components to slot the performance of the product and different constraints
* Maximize process supportability via getting ready for elements obsolescence
* enhance supply-chain interactions and communications with shoppers and regulatory enterprises to lessen time-to-profit

laying off mild on a ignored yet crucial element of product improvement, elements choice and administration will provide your company the instruments you must keep away from the dangers linked to product use whereas selling flexibility, innovation, and creativity on your product improvement.

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