Download Electronics Reliability and Measurement Technology. by Joseph S. Heyman PDF

By Joseph S. Heyman

Content material:
Foreword

, Page v
Preface

, Pages vii-viii, Joseph A. Heyman
- government precis of findings and recommendations

, Pages 1-6
Measurement technological know-how and production technology research

, Pages 7-16, D. Howard Phillips
Nondestructive SEM for floor and subsurface wafer imaging

, Pages 17-33, Roy H. Propst, C. Robert Bagnell, Edward I. Cole Jr., Brian G. Davies, Frank A. DiBianca, Darryl G. Johnson, William V. Oxford, Craig A. Smith
Surface inspection-research and development

, Pages 34-36, J.S. Batchelder
- Sensors built for in-process thermal sensing and imaging

, Pages 37-41, I.H. Choi, K.D. Wise
Wafer point reliability for high-performance VLSI design

, Pages 42-54, Bryan J. Root, James D. Seefeldt
Wafer point reliability checking out: an concept whose time has come

, Pages 55-59, O.D. Trapp
Micro-focus X-ray imaging

, Pages 60-67, Michael Juha
Measurement of opaque movie thickness

, Pages 68-78, R.L. Thomas, J. Jaarin, C. Reyes, I.C. Oppenheim, L.D. Favro, P.K. Kuo
Intelligent laser soldering inspection and strategy control

, Pages 79-88, Riccardo Vanzetti
Rupture trying out for the standard keep watch over of electrodeposited copper interconnections in high-speed, high-density circuits

, Pages 89-106, Louis Zakraysek
- Heterodyne holographic interferometry: High-resolution ranging and displacement measurement

, Pages 107-122, James W. Wagner
- “Whole wafer” scanning electron microscopy

, Pages 123-128, J. Devaney
This web page is deliberately left blank

, Page 129

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Extra resources for Electronics Reliability and Measurement Technology. Nondestructive Evaluation

Sample text

1 to 1 micron micron size size range; range; a regime regime where where particles are more more abundant abundant and they they are much much harder harder to to remove remove from from surfaces. surfaces. H If particles are a key key yield yield killer killer today, today, they they will will and particles are probably worse tomorrow. tomorrow. probably be be worse There are are several several new new specific specific surface surface inspection inspection problems that deserve deserve attention.

A Kevex Kevex energy energy dispersive dispersive x-ray interfaced integrator used to measure spectrometer spectrometer interfaced to a multichannel multichannel integrator was used measure the x-ray Energy x-ray emissions. emissions. 74 x-rays. 74 kV were were used used to detect detect the Al Al and Si Si K K series series characteristic characteristic x-rays. The SEM beam beam was scanned pattern over scanned in a 256 x 256 raster raster pattern over the device; device; x-rays point of the x-rays in each window window were were counted counted for 20 msec msec at each point image.

Time. Many Many deposition deposition and and etching etching steps produce surfaces that that are are so rough rough that that monitor monitor inspection inspection tooling tooling is relatively relatively insensitive. insensitive. steps produce surfaces Particle Particle collection collection rates rates depend depend on on the the features, features, composition, composition, and and chemical chemical treatment treatment of of the the surface, surface, and between monitors product and are therefore therefore different different between monitors and and product.

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